Parameter configuration
Chip design
GPP chips excel in performance and reliability. Utilizing a glass passivation process, the P-N junction of the chip is tightly protected by passivated glass. Compared to traditional acid washing (OJ) processes, it exhibits significant advantages in terms of resistance to external forces and thermal shock, effectively avoiding failure issues such as gas leakage. GPP chips exhibit extremely low leakage current, with a leakage current as low as 2μA at room temperature. Furthermore, they operate over a wide temperature range, from -55℃ to 150℃, with excellent high-temperature reverse bias performance, maintaining stable operation even under a high-temperature reverse bias (HTRB) of 150℃. Additionally, the chips demonstrate excellent consistency, ensuring similar performance across batches of products, laying a solid foundation for stable circuit operation and exhibiting superior characteristics in various electronic devices.
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